I don't think epoxy is a good idea.
- Epoxy won't take the temperatures needed for ABS printing, so you would be stuck with materials that don't require higher bed temperatures. You may be able to use a high-temperature epoxy, but see next concern.
- PLA may stick to epoxy too good (this is unverified) - then the next printed object might pull out the epoxy and even more of the ceramic bed.
- Silicone - Advantage: can take high temperatures, no filament materials will stick to it. Disadvantage: no filament material will stick to it (if the hole is too large, this would be a distinct disadvantage). Possibly too soft, which would pose a problem during a Heat Bed Scan.
- Cement or tile glue - Advantage: can take high temperatures. Disadvantage: probably a rougher surface than the tile itself. Unknown if the adhesion to the tile will be greater than to the filament material.
- Solder - Advantage: can take temperatures up to 180°, smooth surface. Disadvantage: unknown if you can make it bond to the tile.
mjh11